Improved signal integrity due to reduced tracklength. Read and lverything you need to know about microvia manufacturing processes from expert happy holden. Use blind vias, buried vias, or microvia techniques builtup laminations and highsignal performance considerations. The highdensity interconnect hdi market is projected to grow at a cagr of 12. This can be done using either hdimicrovia layers or throughvias. Design rules for hdi pcbs ilfa feinstleiter technologie. Hdi microvia fanouts for laser drilled microvia stackups use the same principles as mechanically drilled blind and buried vias. Normally vips like to be the stars of the show, but in printed boards, theyre mostly hidden. Four or more layer pcb design for beginners using eagle. Control units for cars, consumer and communicationselectronics, industrial electronics.
It is an important metric you need to be aware of when specifying the minimum via hole size for your design, and designing your stackup. Scribd is the worlds largest social reading and publishing site. Participants discover how to realize greater return on investment, develop and maintain formal procedures for increased productivity and consistency, and manage customer perceptions. Pcbs are all developed to highdensity thinline, and hdi boards are particularly prominent. Ipc2315 design guide for high density interconnects and. Hdi pcb design seminar cancelledthis 1 day hdi pcb design seminar examines advanced engineering and design techniques for the interconnection of area array components from asic packaging, portable products, high performance computing, and telecom to dense multichip modules. Whats good about hdi via structures check out the spb16. The microvia pwbs are commonly referred to as buildup bu or sequential buildup sbu pwbs.
This features the use of extremely thin tracks and tiny vias called microvias. Differing requirements of the customer must be explicitly agreed. Addresses various considerations when designing an hdi printed wiring board including design examples and processes, selection of materials, general descriptions, and. This will include new via shapes as well as the design rules that go along with them.
Everything you need to know about micro via pcb design. This paper is intended to be a comprehensive roadmap of the design process, with a focus on the selection of materials, films, and extensive range of options. Microvia structures, how to reduce layers with channels, creating boulevards to increase routing density. Theyll also help you better utilize viainpads vips, are more easily buried, and can make high density interconnect hdi design a breeze. Hdi officially refers to any vias and via pads with diameters of 6 mils 0. Fundamentals and design forreliability rules chapter 64. Finally, with this background and experience, hdi can be applied in the most favorable way. With five factories and an interconnect technology lab in china, multek enables customers success globally and in a variety of product applications.
Our weekly design enewsletter focuses on pcb design topics, including special columns and other unique editorial. Hdi via structures effect on pcb design flexibility. Effects of voiding on the degradation of microvias in high density interconnect printed circuit boards under thermomechanical stresses. Which is ratio of the hole diameter to depth not to exceed 0. Uses both plated microvia and pth for interconnection, employing blind, but not buried vias. They are also defined by the ipc in the hdi design standard, ipc2226. This is an overview of hdi and provides models for estimation design density. There are many benefits to laser drilling microvias, including real estate savings, impedance control, circuit reliability, and rf line termination. Advanced circuits offers expanded pcb manufacturing capabilities including laserdrilled microvias for hightech requirements. Jan 15, 2009 if questions persist about design rules, electrical performance, or reliability, then consider creating a simple test vehicle. This study was designed to understand the reliability of type 1, type 2, and type 3 microvias.
These design rules apply to the bu and sbu interconnects using materials defined in ipcjpca4104. Design guide for high density interconnects hdi and. Hdi or mft boards can be produced with smaller tolerances. Design guide for high density interconnects hdi and microvias. Defines a single microvia layer on either one or both sides of core. Once you are set up with your manufacturer, your next step will be to configure your pcb design tools for working with microvias. Apr 05, 2012 some design tools can automate this process, developing the interconnect in minutes versus days. Theres a lot that you will need to do in the tools to efficiently work with the details of microvia design. This specification educates users in microvia formation, selection of wiring density, selection of design rules, interconnecting structures, and material characterization. Quickturn hdi pcb prototype manufacturing in the usa. Hdi design selection guideline this guideline provides an easy to follow tutorial on the selection of hdi and microvia design rules and structures.
Order printed circuit boards, pcbs and stencils for low costs. The book presents practical aspects related to the measurement of rotational power loss in soft magnetic. A design of experiment finite element simulation was performed to quantify the effects of design, material, and defect parameters on microvia lifetime. Ppt a pcb technology powerpoint presentation free to.
The characteristics of these materials are found in section 5. Hdi via structures effect on pcb design flexibility, constraints and cost. From telecommunications, mobile, wearables, and computing to automotive, medical, aerospace, and industrials, multek is. Pcb basic design rules 102019 multi circuit boards. Initial hdi fabrication high density interconnect print. It is very difficult ult to change the design and parts once the board is already being made. Published jointly with the japan printed circuits association, ipcjpca2315 provides an easy to follow tutorial on the selection of hdi and microvia design rules and structures. Although the microvia process increases the cost of the hdi pcb, the proper design and reduction in layer count reduces cost in. Schweizer electronic ag leading producer of pcbs in europe. High density interconnect printed circuit boards and substrates are widely used for. For most of us, is difficult to use or design hdi mircrovia pcb board, right now, electronic device become smaller and thinner, request designer to use limit pcb area to fill more electronic. Jun 01, 2000 published jointly with the japan printed circuits association, ipcjpca2315 provides an easy to follow tutorial on the selection of hdi and microvia design rules and structures.
This advancement in pcb technology is driven by the miniaturization of components and semiconductor packages that supports advanced features in revolutionary new products. Published jointly with the japan printed circuits association, ipc2315 provides an easy to follow tutorial on the selection of hdi and microvia design rules and structures. Hdi printed circuit boards high density interconnect pcb. Hdi is another via technology used to form very small vias where drilling holes, using a conventional drill bit, is impractical. The basic methodology is described in a recent book by charles pfeil and automated in systems such as mentor graphics expedition enterprise. Abstract reliability of microvia has been a concern since microvias were introduced to our industry.
Previously, microvia was any hole less than or equal to 0. A stacked microvia is usually filled with electroplated copper to make electrical interconnections between multiple hdi layers and provide structural support for the outer levels of the microvia or for a component mounted on the outermost copper pad. Business business, international computers and office automation circuit printing laminated materials laminates. Hdi pcb is high density interconnection pcb, it widely used in small bga board as its more advantages. Pdf novel hcoil design with improved immunity to offaxis.
Business business, international computers and office automation circuit printing laminated materials laminates polychlorinated. Survival is not mandatory by steve williams flexible circuit technology fourth edition by joseph fjelstad. Hdi high density interconnection circuit boards and microvia technology are inextricably linked. Reliability of microvia printed circuit boards chapter 62. What are the specifications for hdi and microvia materials. Quickturn hdi pcb prototype manufacturing in the usa sierra. This weekly newsletter features content focused on the manufacture of flexible printed circuits. The variety of stackups and smaller via sizes provide for tighter shifted column and row patterns, improved route density and greater flexibility in assigning routes to buildup layers than does standard laminated cores.
To establish the design rules and hdi design methodology, consider the redesign of an existing highdensity th board using the advice in chapter 3 hdi design. Tolerances and design limits pattern tolerances tolerance drilling pth to conductive pattern outer layers 0,10mm drilling pth to conductive pattern inner layers 0,15mm drilling pth to milling pattern contour 0,10mm. A recommended hdi planning process to add the the general pcb design process. Careful planning and consideration into the design and manufacturing process are crucial to ensuring exactly what you need is the result. Contact your local sales office to get started on improving your design environment. The group also suggested that the ipc2220 series be updated relative to hdi microvia design rules so that ipc2226, sectional design standard for hdi microvia printed boards, could be cancelled, much like what is being down within the ipc6010 series and the ipc6016 hdi specification. Laser drilling microvias request quote microvias are becoming more and more common in the board designs of today. Dec 16, 2017 for most of us, is difficult to use or design hdi mircrovia pcb board, right now, electronic device become smaller and thinner, request designer to use limit pcb area to fill more electronic.
Finepitch and highio bga design rules, layer assignment, and routing. However, formatting rules can vary widely between applications and fields of interest or study. The definition of hdi board a decade ago was that the line widthline spacing was 0. Your particular cad platform will have various checks and tests that can be performed on the finished pcb design. One exciting and relatively recent circuit board development is that of high density interconnect hdi. It is a departure from traditional ipc documents in that it carries in it a lengthy tutorial on how to calculate and select the proper design rules and. Pdf effects of voiding on the degradation of microvias. Hdi high density interconnect pcbs ttm technologies, inc. Resolve all your workaday questions with the pcb answer book.
Get to know microvia manufacturing processes and hdi. Addresses various considerations when designing an hdi printed wiring board including design examples and processes, selection of materials, general descriptions, and various microvia technologies. According to the ipc2221aipc2222 design guidelines a maximum aspect ratio of 6. Use blind vias, buried vias, or microvia techniques built. Thin film highdensity interconnect hdi design guidelines. Hdi high density interconnect pcbs hdi pcbs capitalize on the latest technologies available to increase the functionality of pcbs using the same or less amount of area. Although the microvia process increases the cost of the hdi pcb, the proper design and reduction in layer count reduces cost in material square inches and layer count more significantly. Faq about pcbs hdi, via hole, pcb plating and more ncab group. Microvia aspect ratio in pcb design advanced pcb design. Planarity of dielectrics for high density interconnection hdi microvia technology.
Hdi support center director hdi scd training focuses on the development and execution of strategic plans that will take the organization to the next level. Multek is a valueadded manufacturer of rigid, flexible and rigidflex printed circuits, and offers printed electronics. High density interconnect hdi and microvia technologies are the pwb industrys current manufacturing challenge. The new ipc hdi design document, ipc2315 design guide for high density interconnect structures and microvias is a remarkable document developed over the last two years. Having an incomplete plan for what the hdi boards should do and what components it needs will slow down the process.
This specification educates users in microvia formation, selection of wiring density, selection of design rules, interconnecting structures, and material. The impact of design variables and lead free chapter 63. Dedicate to the technologies innovation, being engaged in ic substrates, high density interconnect pcb, multilayer pcb, rigid flexible pcb, flexible, radio frequency pcb. The woodstock project plans to use ipc type i design firstly, if the ipc type i design can not fan out the bga signals, then the ipc type ii will be next approach. Defining the best in printed circuit board design and technology and unparalleled in thoroughness and reliability, coombs printed circuits handbook, fifth edition provides definitive coverage of every facet of printed circuit assemblies, from design methods to manufacturing processes. Hdi stackups, design considerations, and hdi stackup layer information. For this reason, mlt has developed laser microvia processes to work with a. The graphic below shows the main structures type i, type ii and type iii as defined in ipc2226. Planarity of dielectrics for high density interconnection hdi microvia technology 1198. High density interconnect hdi and microvia technologies. The purpose is to educate the circuit user on thin film high density interconnects hdi and the benefits of design performance. Current pcb book tobill ratio all pcb book tobill ratios ipc statistical programs.
Pcb vias an overview bert simonovichs design notes. Ipc standards revised the definition of a microvia in 20 to a hole with an aspect ratio of 1. With the advent of smartphones and handheld electronic devices, microvias have evolved from single. It is a departure from traditional ipc documents in that it carries in it a lengthy tutorial on how to calculate and select the proper design rules and structures for very high density assemblies. Microvias are minute holes drilled by a laser to generate the electrical connection between the layers in a multilayer circuit board. Day 2 high density design strategies using hdi for your products. Hdi design selection guideline this guideline provides an easy to follow tutorial on the selection of hdi and microvia design rules. Initial hdi fabrication high density interconnect print what are the specifications for hdi and microvia materials. The difficulty is selecting the right microvia hdi structure. Provides the possibility to have a via hole connect direct in the smd or bga pad. Increased interconnection density by miniaturization of holes,pads and conductors.
1466 1118 446 176 1326 1263 403 1289 734 1346 1415 158 1505 198 191 318 113 961 1023 1307 1352 1137 1495 744 53 927 1239 1494 1218 508 690 1195 133